The various compositions of polyimide (PI)/polyamideimide (PAI) composites were prepared by heat treatment of the solvent cast PI precursors/PAI blends. The optical micrographs showed that a good compatibility was observed between poly(amic acid) (PAA) and PAI, but in the case of PAME/PAI mixtures, a phase separation apparently occurred due to the absence of ionic and/or H-bonding forces. Regardless of PI precursors, the similar tensile properties were observed. The tensile modulus of the composites were higher than that of the neat polyimide. The X-ray diffraction patterns of the composites showed that the chain rearrangement of PI was increased due to the plasticizing effect of PAI, which has lower glass transition temperature than that of PI, during thermal imidization process.