저온($320^{circ}$C)에서 $SiH_4$와 $N_2O$ 가스의 혼합을 통해 플라즈마화학기상증착(PECVD)법을 이용하여 실리카 광도파로의 클래딩막으로 사용되는 $SiO_2$ 후막을 제조하였으며, 공정변수로는 $N_2O/SiH_4$ 유량비와 RF power에 변화를 주었다. 증착된 시편은 $N_2$ 분위기의 열처리로에서 $1050{circ}$에서 2시간동안 열처리하였다. $N_2O/SiH_4$ 유량비가 증가함에 따라 증착속도는 $9.4~2.9{mu}m /h$까지 감소하였으며, RF power가 증가함에 따라 증착속도는 $4.7~6.9{mu}m /h$까지 증가하였다. 두께 및 굴절률은 Prism Coupler를 이용하여 분석하였다. 화학적 성질 및 구조적 성질은 X-ray Photoelectron Spectroscopy(XPS)와 Fourier Transform-Infrared Spectroscopy(FT-IR)를 이용하여 분석하였으며, Scanning Electron Microscopy(SEM)를 이용하여 시편의 단면을 관찰하였다.
Silicon dioxide thick film using silica optical waveguide cladding was fabricated by Plasma Enhanced Chemical Vapor Deposition(PECVD) method, at a low temperature ($320^{circ}$C) and from $(SiH_4+N_2O)$ gas mixtures. The effects of deposition parameters on properties of $SiO_2$ thick films were investigated by variation of $N_2O/SiH_4$ flow ratio and RF power. After the deposition process, the samples were annealed in a furnace at $1150^{circ}$C, in N2 atmosphere, for 2h. As the $N_2O/SiH_4$ flow ratio increased, deposition rate decreased from 9.4 to 2.9 ${mu}m/h$. As the RF power increased, deposition rate increased from 4.7 to 6.9 ${mu}m/h$. The thickness and the refractive index measurements were measured by prism coupler. X-ray Photoelectron Spectroscopy(XPS) and Fourier Transform-infrared Spectroscopy(FT-IR) were used to determine the chemical states. The cross-section of films was observed by Scanning Electron Microscopy(SEM).
