As mobile communication devices use wide bands for large data transmission, Low Temperature Co-fired Ceramic(LTCC) has been a candidate for module substrate, for it provides better electrical properties and enables various embedded passive devices compared to conventional PCB. The LTCC, however, has applied in limited area because of non-uniform shrinkage. Hybrid heating was developed to raise sample temperature uniformly in a short period of time This leads to unidirectional sintering which enables sample to be sintered layer by layer from the bottom, resulting in more stable shape of interconnection at the top surface of the sample than conventional electric furnace heating. When sintering properties of substrate and electrical/mechanical properties of interconnection were compared, hybrid heating showed possibility to be applicable to substrate miniaturization and interconnection densification superior to electric furnace heating.