Elastic-factor of elastic epoxy were investigated by TMA (Thermomechanical Analysis), DMTA (Dynamic Mechanical Thermal Analysis), TGA (Thermogravimetric Analysis) and FESEM (Field Emission Scanning Electron Microscope) for structure-images analysis as toughness-investigation to improve brittleness of existing epoxy resin. A range of measurement temperature of the TMA and DMTA was changed from -20($^{circ}C$) to $200^{circ}(C)$, and TGA was changed from $0^{circ}(C)$ to $600^{circ}(C)$. Glass transition temperature (Tg) of elastic epoxy was measured through thermal analysis devices with the content of 0(phr), 20(phr) and 35(phr). Also, thermal expansion coefficient (a), high temperature, modulus and loss factor were investigated through TMA, TGA, and DMTA. In addition, the structure of specimens was analyzed through FESEM, and then elastic-factor of elastic epoxy was visually showed by FESEM. As thermal analysis results, 20(phr) was more excellent than 30(phr) thermally and mechanically. Specially, thermal expansion coefficient, high temperature, modulus, and damping properties were excellent. By structure-images analysis through FESEM, we found elastic-factor of elastic epoxy that is not existing epoxy, and proved high impact.