- PECVD법에 의한 TiN, TiCN 증착 시 gradient plasma power가 코팅층에 미치는 영향
- ㆍ 저자명
- 김동진,신창현,허정,남태운,Kim. D.J.,Shin. C.H.,Hur. J.,Nam. T.W.
- ㆍ 간행물명
- 열처리공학회지
- ㆍ 권/호정보
- 2004년|17권 4호|pp.236-240 (5 pages)
- ㆍ 발행정보
- 한국열처리공학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
Effect of plasma power on PECVD process were investigated in this study. TiN and TiCN films were deposited on nitrided STD11 steel with 600W, 1,200W and 1,600W plasma power. As the plasma power was increased, the preferred orientation was reinforced from (200) to (111) and the hardness of films was improved. The low plasma power was, however, effective for improving of adhesion force of films. Regarding above properties, TiN and TiCN films were deposited by gradient plasma power. It was possible to get high hardness as well as adhesion force through gradient plasma power.