In this thesis, We Fabricated Cu thin films of 1000 $AA$, 3000 $AA$, and 6000 $AA$ thickness on the single crystal sapphire, polycrystal alumina, and amorphous slide glass substrates deposited by electron beam evaporation(EBE) method. We investigated properties of resistivity and adhesion of these Cu thin films under various conditions, substrate temperature(room temperature, 10$0^{circ}C$, 20$0^{circ}C$ under vacuum) and annealing temperatures(400 $^{circ}C$, 600 $^{circ}C$ for 30 min after the deposition). We found that these adhesion was increased in order of slide glass, sapphire, and alumina. The adhesion of the Cu thin films on alumina was high value about 4 times, compared with that of the Cu thin films on slide glass. We found that these resistivities were decreased with increasing substrate temperature and thin film thickness. The resistivity(2.05 $mu$Ωulcornercm) of the Cu thin films with 6000 $AA$ thickness at 200 $^{circ}C$ on the slide glass was low value, compared with that of aluminum(2.66 $mu$Ωulcornercm).