- BGA 패키지를 위한 언더필의 열적 특성과 유동성에 관한 연구
- ㆍ 저자명
- 노보인,이보영,김수종,정승부,Noh. Bo-In,Lee. Bo-Young,Kim. Soo-Jung,Jung. Seung-Boo
- ㆍ 간행물명
- 大韓溶接學會誌
- ㆍ 권/호정보
- 2006년|24권 2호|pp.57-63 (7 pages)
- ㆍ 발행정보
- 대한용접접합학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
In this study, the curing kinetics and thermal degradation of underfill were investigated using differential scanning calorimetry (DSC) and thermo gravimetry analysis (TGA). The mechanical and thermal properties of underfill were characterized using dynamic mechanical analysis (DMA) and thermo-mechanical analysis (TMA). Also, we presented on underfill dispensing process using Prostar tool. The non-isothermal DSC scans at various heating rates, the exothermic reaction peak became narrower with increasing the heating rate. The thermal degradation of underfill was composed of two processes, which involved chemical reactions between the degrading polymer and oxygen from the air atmosphere. The results of fluidity phenomena were simulated using Star CD program, the fluidity of the underfills with lower viscosity was faster.