The residual stress induced in the superconducting layer was estimated using analytical approach coupled with electro-mechanical test results and XRD measurements. The residual stress measured based on the $I_{c}/I_{c0}$-strain degradation behavior showed similar value with the measured residual stress using XRD. The calculated residual stress based on the thermal analysis showed the lowest value. This could be explained by the additional intrinsic residual stresses induced in the superconducting film during deposition.