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Crystallization Behavior of Ti-(50-x)Ni-xCu(at%) (x = 20-30) Alloy Ribbons
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  • Crystallization Behavior of Ti-(50-x)Ni-xCu(at%) (x = 20-30) Alloy Ribbons
  • Crystallization Behavior of Ti-(50-x)Ni-xCu(at%) (x = 20-30) Alloy Ribbons
저자명
Kim. Min-Su,Jeon. Young-Min,Im. Yeon-Min,Lee. Yong-Hee,Nam. Tae-Hyun
간행물명
Transactions on electrical and electronic materials
권/호정보
2011년|12권 1호|pp.20-23 (4 pages)
발행정보
한국전기전자재료학회
파일정보
정기간행물|ENG|
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이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
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기타언어초록

Amorphous Ti-(50-x)Ni-xCu (at%) (x = 20, 25, 27, 30) alloy ribbons were prepared by melt spinning. Subsequently, the crystallization behavior of the alloy ribbons was investigated by X-ray diffraction and differential scanning calorimetry. ${Delta}T$ (the temperature gap between $T_g$ and $T_x$) increased from 33 K to 47 K and the wavenumber ($Q_p$) decreased from 29.44 $nm^{-1}$ to 29.29 $nm^{-1}$ with increasing Cu content from 20 at% to 30 at%. The activation energy for crystallization decreased from 188.5 kJ/mol to 170.6 kJ/mol with increasing Cu content from 20 at% to 25 at%; afterwards, the activation energy remained near constant. Crystallization occurred in two-stage: amorphous-B2-$TiCu_2$ in Ti-Ni-Cu alloys with Cu content less than 25 at%, while it occurred in three-stage; amorphous-B2-TiCu-$TiCu_2$ in Ti-Ni-Cu alloys with Cu content more than 27 at%.