Heat generation is inevitable during the chemical mechanical planarization (CMP) process because the mechanical and chemical removal of material is carried out by using abrasives and chemicals in the CMP slurry. In this paper, results obtained from experiments performed on a membrane-type carrier having a retaining ring were used to study the temperature distribution in a polishing pad during the CMP process. To understand and predict the distribution of temperature rise, a kinematical analysis of the temperature distribution was performed by considering the frictional characteristics of the process. The results of this study can be used to predict the temperature distribution in a polishing pad, and such predictions can help in developing a more effective CMP process.