- 사출성형 해석을 통한 Weldline 및 Flow mark 개선사례
- ㆍ 저자명
- 이영창,Lee. Yeong Chang
- ㆍ 간행물명
- 한국정밀공학회지
- ㆍ 권/호정보
- 2013년|30권 12호|pp.1295-1301 (7 pages)
- ㆍ 발행정보
- 한국정밀공학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
The cause of flow mark defect is known as non-uniform temperature of mold surface when the flow front meets the cold cavity. The exact definition and classification of Flow mark is not clear because the mechanism of flow mark is not figured out till now. Any injection molding analysis software can not predict the flow mark phenomena. To solve weldline and flow mark defects, the gate thickness is reduced to increase the melt front velocity and the melt front velocity of the flow mark area is increased from 82.3mm/s to 104.7mm/s. In addition, the bulk temperature of the flow mark area is increased from $178.3^{circ}C$to $215.2^{circ}C$ by adding a cold slug well. The flow mark phenomena can be greatly reduced by increasing the flow front velocity and elevating the bulk temperature.